Mechanism Board Resin

Mechanism board resin, also known as electrical insulation resin or electronic encapsulation resin, is a type of resin used for the protection and encapsulation of electronic components and circuit boards. It is specifically designed to provide electrical insulation, thermal conductivity, and mechanical protection to sensitive electronic devices. Mechanism board resin can be a thermosetting epoxy or polyurethane resin that cures and forms a protective layer around the electronic components. It offers excellent adhesion to different substrates, low shrinkage, and resistance to temperature, moisture, and various chemicals. This type of resin is widely used in the electronics industry for applications such as potting, encapsulation, and coating of circuit boards, integrated circuits, sensors, and power modules.